Light emitting device package

ABSTRACT

A light emitting device package may be provided that includes: a lead frame which includes a first frame and a second frame disposed on both sides of the first frame respectively; a light emitting device which is disposed on the first frame and is electrically connected to the second frame; and a resin body which includes a first resin body which is disposed between the first frame and the second frame, and a second resin body which covers an outer surface of the lead frame. An end of the first frame and an end of the second frame are disposed on an outer surface of the second resin body.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority under 35 U.S.C. §119(a) ofKorean Patent Application Nos. 10-2014-0084907 and 10-2014-0084908 filedJul. 8, 2014, the subject matters of which are incorporated herein byreference.

BACKGROUND

Field

This embodiment relates to a light emitting device package.

Description of Related Art

A light emitting diode (LED) is a light source with high efficiency andenvironmental friendliness and becomes popular in a variety of fields.The LED is being used in various fields, for example, a display, opticalcommunication, an automobile and general lighting. Particularly, demandfor a white light emitting diode creating white light is graduallyincreasing.

In general, after an individual element is manufactured, such a lightemitting device is used by packaging the elements. In the light emittingdevice package, a light emitting chip is mounted on a resin bodyincluding a heat sink. The light emitting chip is electrically connectedto a lead through a wire. The upper portion of the light emitting chipis filled with a sealing material. A lens is provided on the upperportion. In the light emitting device package having the describedstructure, since heat generated by operating the light emitting deviceis slowly transmitted, the light emitting device package has a low heatradiation effect. Therefore, the optical characteristics of the lightemitting device may be deteriorated and a package process in which theheat sink is inserted between the resin bodies is difficult to have ahigh process speed.

When the light emitting device is mounted on a lead frame without theheat sink, the heat is released through the lead frame, so that heatradiation performance is degraded. Therefore, a high power lightemitting device is difficult to be mounted on the lead frame. Also, whenthe resin body which is used in the lead frame for the light emittingdevice is exposed to the light for a long time, the resin body isdiscolored or deteriorated, so that the optical characteristics aredeteriorated.

When light emitted from the light emitting device is incident on theresin body, the reflectance is low. Accordingly, for the purpose ofincreasing the reflectance of the light emitting device package, it isrequired to reduce the resin body in the area reflecting the light.

SUMMARY

One embodiment is a light emitting device package. The light emittingdevice package includes: a lead frame which includes a first frame and asecond frame disposed on both sides of the first frame respectively; alight emitting device which is disposed on the first frame and iselectrically connected to the second frame; and a resin body whichincludes a first resin body which is disposed between the first frameand the second frame, and a second resin body which covers an outersurface of the lead frame. An end of the first frame and an end of thesecond frame are disposed on an outer surface of the second resin body.

Another embodiment is a light emitting apparatus including a substrateand a light emitting device package disposed on the substrate. Thesubstrate includes a first terminal and a second terminal disposed onboth sides of the first terminal respectively. The light emitting devicepackage includes: a first frame which is electrically connected to thefirst terminal, and a second frame which is disposed on both sides ofthe first frame respectively and is electrically connected to the secondterminal; a light emitting device which is disposed on the first frameand is electrically connected to the second frame; and a resin bodywhich includes a first resin body which is disposed between the firstframe and the second frame, and a second resin body which covers thelead frame. An end of the first frame and an end of the second frame aredisposed on an outer surface of the second resin body.

BRIEF DESCRIPTION OF THE DRAWINGS

Arrangements and embodiments may be described in detail with referenceto the following drawings in which like reference numerals refer to likeelements and wherein:

FIG. 1 is a perspective view of a light emitting device packageaccording to an embodiment;

FIG. 2 is a sectional perspective view of the light emitting devicepackage according to the embodiment;

FIG. 3a is a cross sectional view of the light emitting device packageaccording to the embodiment;

FIG. 3b is a partial enlarged view of FIG. 3 a;

FIG. 4 is a plan view of the light emitting device package according tothe embodiment;

FIG. 5 is a perspective view of a lead frame;

FIG. 6 is a bottom perspective view of the light emitting device packageaccording to the embodiment;

FIGS. 7a to 7c are perspective views showing that the light emittingdevice package according to the embodiment has been coupled to anexternal substrate;

FIG. 8 is a perspective view of a lead frame prototype without the leadframe according to the embodiment;

FIG. 9 is a perspective view showing that the light emitting devicepackage without a light emitting device mounted thereon is coupled tothe lead frame prototype;

FIG. 10 is a perspective view showing a structure of the light emittingdevice package which can be mass-produced;

FIGS. 11a to 11f are views for describing a process of manufacturing thelight emitting device package according to the embodiment;

FIG. 12 is a view showing the final form where the light emitting devicepackage according to the embodiment has been formed on the lead frameprototype;

FIGS. 13a and 13b are views for describing that a release pin is removedfrom the light emitting device package according to the embodiment; and

FIGS. 14a and 14b are views for describing how to couple a reflector andthe lead frame in accordance with the embodiment.

DETAILED DESCRIPTION

A thickness or a size of each layer may be magnified, omitted orschematically shown for the purpose of convenience and clearness ofdescription. The size of each component may not necessarily mean itsactual size.

It should be understood that when an element is referred to as being‘on’ or “under” another element, it may be directly on/under theelement, and/or one or more intervening elements may also be present.When an element is referred to as being ‘on’ or ‘under’, ‘under theelement’ as well as ‘on the element’ may be included based on theelement.

An embodiment may be described in detail with reference to theaccompanying drawings.

FIG. 1 is a perspective view of a light emitting device packageaccording to an embodiment. FIG. 2 is a sectional perspective view ofthe light emitting device package according to the embodiment shown inFIG. 1. FIG. 3a is a cross sectional view of the light emitting devicepackage according to the embodiment shown in FIG. 2. FIG. 3b is apartial enlarged view of FIG. 3 a.

Referring to FIGS. 1 to 3 b, a light emitting device package 1 accordingto the embodiment may include a light emitting device 100 includinglight emitting chip 110 and a sub mount 120 on which the light emittingchip 110 is disposed, a lead frame 200 on which the light emittingdevice 100 is disposed, a wire 130 which electrically connects the lightemitting device 100 with the lead frame 200, a reflector layer 140 whichsurrounds the light emitting device 100 and reflects the light emittedfrom the light emitting device 100, an insulation layer 323 which islocated between the lead frame 200 and the reflector layer 140, and aresin body 300 which forms the body of the light emitting device package1.

The light emitting device 100 may be a light emitting diode (LED).However, there is no limit to this. The light emitting diode may be adeep ultraviolet (DUV) LED which emits deep ultraviolet. However, thereis no limit to this. The light emitting diode may be red, green, blue orwhite light emitting diodes which emit red, green, blue or white lightrespectively. The light emitting diode is a kind of a solid statecomponent which converts electrical energy into light and generallyincludes a semiconductor-made active layer interposed between twoopposite doped layers. When a bios is applied to both ends of the twodoped layers, electron holes and electrons are injected into the activelayer and recombined with each other in the active layer, and then lightis generated. The light generated in the active layer is emitted in alldirections or in a particular direction, and then is emitted outside thelight emitting diode through an exposed surface.

The light emitting chip 110 may be a flip chip. However, the lightemitting chip 110 is not necessarily limited to this. The light emittingchip 110 may be a vertical chip or a lateral chip. For convenience, inthe drawings, the lateral chip will be described. The light emittingchip 110 may be formed to have 600 um in width and 700 um in length andis not necessarily limited to this. The light emitting chip 110 may emitdeep ultraviolet with a wavelength of from 190 nm to 400 nm. Morespecifically, the light emitting chip 110 may emit deep ultraviolet witha wavelength of from 250 nm to 280 nm, and in this case, the deepultraviolet which is emitted from the light emitting chip 110 has themost excellent sterilizing power. Though not shown in FIG. 1, the lightemitting chip 110 may include a substrate and a light emitting structurein which a first conductive semiconductor layer, an active layer, and asecond conductive semiconductor layer which are sequentially disposed onthe substrate. The substrate of the light emitting chip 110 may havelight transmission characteristics that allow the light to passtherethrough. The substrate may be at least any one of both aninsulation substrate such as sapphire (Al₂O₃), spinel (MgAl₂O₄) and asemiconductor substrate such as SiC, Si, GaAs, GaN, InP, Ge, etc.

The light emitting chip 110 is mounted on the sub mount 120. The submount 120 radiates the heat generated by the light emitting chip 110 andtransfers the heat to the lead frame 200 located thereunder. Also, anend of the wire 130 electrically connecting the light emitting device100 with the lead frame 200 is connected to the sub mount 120. The submount 120 may be made of a material having high thermal conductivitylike AlN or SiC, etc., and is not necessarily limited to this.

Referring to FIGS. 2 to 3 b, the reflector 140 of the light emittingdevice package 1 according to the embodiment reflects the light emittedfrom the light emitting device 100. The reflector 140 surrounds thelight emitting device 100 and is disposed on the lead frame 200. Thereflector 140 may be made of a metallic material. Specifically, thereflector 140 of the light emitting device package 1 according to theembodiment may be made of pure aluminum. Therefore, the reflector 140may have a high optical reflectance, a high thermal diffusivity andcorrosion resistance to oxygen and hydrogen sulfide. The reflector 140may have an inward concave circular shape and the shape of the reflector140 is not necessarily limited to the circular shape.

A lens guide 150 on which an optical lens may be disposed may be formedon the reflector 140. A plate guide 160 on which a plate may be disposedmay be formed on the reflector. The lens guide 150 may be formed by boththe top surface of the reflector 140 and a wall 321 formed by an end ofa below-described second resin body 320. Also, the plate guide 160 maybe formed by both a flat portion formed on the top surface of the secondresin body 320 and one side of the wall protruding upward. This will bedescribed later. A sealing resin material may be filled between thereflector 140 and the optical lens or between the reflector 140 and theplate. A silicone resin may be used as the sealing resin material.Meanwhile, the optical lens or the plate according to the embodiment maybe a glass lens or a glass plate, which includes a fluorescent material.Therefore, since the optical lens or the plate includes the fluorescentmaterial without dispersion of the fluorescent material within theoptical lens or the plate or without using the sealing materialincluding the fluorescent material, Lumen maintenance can be improved.In other words, the reliability of the light emitting device package 1can be improved.

The lead frame 200 is disposed under the light emitting device 100. Thelight emitting device 100 is disposed on the lead frame 200. The leadframe 200 may include a first frame 210 on which the light emittingdevice 100 is directly disposed, and a second frame 220 which iselectrically connected to the light emitting device 100 through the wire130. An opening into which a below-described first resin body 310 of theresin body 300 is inserted may be formed between the first frame 210 andthe second frame 220. Meanwhile, the lead frame 200 may be made of acopper alloy including copper (Cu). Therefore, the lead frame 200 mayhave a thermal conductivity twice or three times higher than that of AINof the sub mount 120. When the thickness of the lead frame 200 isincreased, the lead frame 200 can function as a heat sink. Accordingly,the light emitting device package 1 according to the embodiment does notrequire a separate heat sink and is advantageous in cost due to the useof copper.

When the thickness of the lead frame 200 is increased, the lead frame200 can function as a large-capacity heat sink. Although the increasedthickness of the lead frame 200 increases the cost of the lead frame200, the cost required for increasing the thickness is lower than a costrequired for adding a separate heat sink. Also, the thicker thecopper-made lead frame 200, the higher the thermal diffusivity and theless the thermal expansion. When the thickness of the lead frame 200 isincreased, a friction force between the lead frame 200 and the resinbody 300 increases and foreign substances and moisture are difficult topermeate into the light emitting device package 1 from the bottom of thelead frame 200. Also, the increased thickness of the lead frame 200increases resistance to the transformation due to an external stress.

Specifically, the thickness of the copper-made lead frame 200 may befrom 0.5 mm to 1.5 mm. When the thickness of the lead frame 200 is lessthan 0.5 mm, the thermal diffusivity and heat radiation performances aredegraded. When the thickness of the lead frame 200 is larger than 1.5mm, the manufacturing cost may be increased by the increase of thethickness of the lead frame 200 as compared with the increases of thethermal diffusivity and heat radiation performance. Also, when thethickness of the copper-made lead frame 200 is less than 0.5 mm,resistance to the transformation of the light emitting device package 1due to an external stress may become less than an acceptable value. Whenthe thickness of the lead frame 200 is larger than 1.5 mm, themanufacturing cost may be increased.

In summary, when the thickness of the copper-made lead frame 200 is lessthan 0.5 mm, any one of the thermal diffusivity, heat radiation,resistance to the transformation, and moisture permeation preventionperformance becomes less than an acceptable value. These properties areimproved with the increase of the thickness. However, when the thicknessof the copper-made lead frame 200 is larger than 1.5 mm, themanufacturing cost may be more increased in the manufacture of the lightemitting device package 1 as compared with the improvement of thedescribed characteristics.

The light emitting device 100 may be directly disposed on the firstframe 210. Though not shown in the drawings, a die-bonding plate towhich the light emitting device 100 may be bonded may be formed on thetop surface of the first frame 210. The light emitting device 100 may bedisposed on the first frame 210 by using a die-bonding paste. Thedie-bonding paste may include an epoxy resin or silicone resin havinglight resistance. The second frame 220 may be electrically connected tothe light emitting device 100 through the wire 130.

The resin body 300 of the light emitting device package 1 according tothe embodiment may include the first resin body 310 which is insertedbetween the first frame 210 and the second frame 220 of the lead frame200, and the second resin body 320 which surrounds the light emittingdevice 100 and the reflector layer 140 and has a central concaveportion.

The first resin body 310 may be filled between the first frame 210 andthe second frame 220. The second resin body 320 may be formed tosurround the outside and a portion of the upper portion of the reflector140. The first resin body 310 and the second resin body 320 may beformed by injection-molding or transfer molding a thermoplastic resin ora thermosetting resin on the lead frame 200. Various shapes of the firstresin body 310 and the second resin body 320 can be formed by the designof the mold. This will be described later in detail.

A black resin having high weather resistance may be used as thethermoplastic resin or thermosetting resin which is used to form thefirst resin body 310 and the second resin body 320. For example,aromatic nylon which has a black color can be used. However, the blackresin is not limited to this. A resin which is not black may bediscolored or degraded due to long term exposure to heat and light fromthe light emitting device 100. Since the light emitting device package 1according to the embodiment uses the black resin having high weatherresistance, it is possible to prevent ultraviolet with a shortwavelength from being degraded and to prevent the light emitting devicepackage from being discolored. Therefore, when the light emitting deviceis a white light emitting diode, there is no need to use the blackresin, and a white resin may be used. The white resin has an opticaltransmittance higher than that of the black resin, and thus, isadvantageous in optical efficiency.

The insulation layer 323 is located between the reflector 140 made of ametallic material and the lead frame 200 made of a copper alloy, andinsulates the reflector 140 from the lead frame 200. The insulationlayer 323 may be made of a resin or may be integrally formed with theresin body 300. The thickness of the insulation layer 323 may berelatively less than the thicknesses of the reflector 140 and the leadframe 200. Specifically, the thickness of the insulation layer 323 maybe from 0.1 mm to 0.15 mm. When the thickness of the insulation layer323 is less than 0.1 mm, the stability of the insulation between thereflector 140 and the lead frame 200 may be reduced, and when thethickness of the insulation layer 323 is larger than 0.15 mm, theinsulation layer 323 may be degraded by the light emitted from the lightemitting device 100 or the insulation layer 323 may interfere with thelight emitted from the light emitting device 100. Since the insulationlayer 323 according to the embodiment of the present invention issufficiently thin, the light which is emitted from the light emittingdevice 100 may be directly reflected by the reflective surface of thereflector 140 without being interfered by the insulation layer 323.Therefore, the resin-made insulation layer 323 is less degraded and thelight emitting device package 1 according to the embodiment has a highreflection efficiency with respect to the light emitted from the lightemitting device 100.

As shown in FIGS. 1 to 3 b, the second resin body 320 may include arecess 320 a and a concave portion 320 b. A portion of the reflector 140may be inserted and fixed into the recess 320 a. An outer frame 410 of abelow-described lead frame prototype 400 may be coupled to the concaveportion 320 b.

Specifically, the second resin body 320 may include the wall 321 whichis vertically formed on the outsides of both the lead frame 200 and thereflector 140. A protrusion 322 may be formed which protrudeshorizontally toward the light emitting device 100 from the wall 321. Theprotrusion 322 may cover at least a portion of the top surface of thereflector 140. The recess 320 a may be formed to be surrounded by thewall 321 and the protrusion 322 of the second resin body 320 and by thetop surface of the lead frame 200. Meanwhile, as described above, theinsulation layer 323 may be inserted between the reflector 140 and thelead frame 200. Specifically, the insulation layer 323 formed integrallywith the second resin body 320 may be disposed between the bottomreflector 140 and the top surface of the lead frame 200.

The reflector 140 is disposed on the lead frame 200. In the past, thereflector 140 was bonded on the lead frame 200 by using an adhesive. Inthis case, the residue of the adhesive pollutes electrodes or wires,etc. However, in the light emitting device package 1 according to theembodiment, the recess 320 a is formed in the second resin body 320, anda portion of the reflector 140, for example, the outermost portion ofthe reflector 140 is inserted and fixed into the recess 320 a of thesecond resin body 320. Therefore, since the reflector 140 is fixed onthe lead frame 200 without using a separate adhesive, pollution causedby the adhesive can be prevented and the cost can be reduced.

Also, the light emitting device package 1 may include the lens guide 150and the plate guide 160.

The top surface of the reflector 140 has a portion which is openedupward without being covered by the protrusion 322 protruding from thewall 321. This open portion and the end of the protrusion 322 may formthe lens guide 150 on which the lens can be mounted. Also, there may bea level difference between the top surface of the wall 321 and the topsurface of the protrusion 322. Due to the level difference, the plateguide 160 may be formed on which the plate can be mounted.

Meanwhile, the reflector 140 may be made of a high strength metallicmaterial. Therefore, the reflector 140 is difficult to transform. Whenthe reflector 140 is stably fixed on the lead frame 200, the reflector140 is able to reflect the light at a high precision. The concaveportion 320 b will be described later.

FIG. 4 is a plan view of the light emitting device package according tothe embodiment shown in FIG. 1. FIG. 5 is a perspective view of the leadframe shown in FIG. 1.

Referring to FIGS. 1 to 5, the reflector 140 may be disposed on thefirst frame 210 and the second frame 220. An opening may be formedinside the reflector 140. The light emitting device 100 may be disposedin the opening of the reflector 140 and may be filled with a resin.

As shown in FIGS. 4 and 5, the first frame 210 and the second frame 220are partially uneven. Specifically, the first frame 210 may have aportion 210 a concave toward the second frame 220. The second frame 220may have a portion 220 a convex toward the first frame 210 in responseto the concave portion 210 a of the first frame 210. Due to the unevenshapes of the first and second frames 210 and 220, a contact areabetween the first and second frames 210 and 220 and the first resin body310 disposed between the first frame 210 and the second frame 220increases. Therefore, the contact area between the lead frame 200 andthe first resin body 310 increases, so that adhesion between the leadframe 200 and the resin body 300 is increased.

Also, as shown in FIGS. 2 to 5, the lead frame 200 of the light emittingdevice package 1 is a thick copper frame and has a high shapeflexibility. Therefore, a level difference may be formed on the leadframe 200, and the opening formed between the first frame 210 and thesecond frame 220 also has a level difference. Therefore, since the firstresin body 310 is filled according to the shape of the opening formedbetween the first frame 210 and the second frame 220, the contact areabetween both the first and second frames 210 and 220 and the first resinbody 310 increases. Therefore, adhesion between the lead frame 200 andthe first resin body 310 is increased. Also, since the lead frame 200 iscoupled to the first resin body 310 in the form of a level difference, afunction of preventing moisture or foreign substances from permeatingfrom the bottom of the lead frame 200 is improved.

FIG. 6 is a bottom perspective view of the light emitting device packageaccording to the embodiment shown in FIG. 1.

Referring to FIGS. 1 to 6, the first resin body 310 is disposed betweenthe first frame 210 and the second frame 220 of the lead frame 200. Bothlongitudinal ends 310 a of the first resin body 310 extend toward thefirst frame 210 in the width direction thereof, so that a portion ofboth longitudinal ends of the first frame 210 may be buried by the firstresin body 310. Therefore, a gap between the first resin body 310 and aterminal protruding outside the first frame 210 is removed, so that itis possible to prevent that the foreign substances, etc., which mayoccur by mounting the light emitting device 100 on the first frame 210,permeate into the light emitting device package 1 and pollute the wiresor electrodes, etc.

Also, in the light emitting device package 1 according to theembodiment, since the thickness “h” of the lead frame 200 can beincreased, the width “W1” of the first resin body 310 which is insertedinto the opening between the first frame 210 and the second frame 220can become narrower. Specifically, since the thickness “h” of the leadframe 200 is large, the contact area between the lead frame 200 and thefirst resin body 310 is sufficient. Therefore, the width “W1” of a topsurface 311 of the first resin body 310 may become narrower.Specifically, the width “W1” of the top surface 311 of the first resinbody 310 may be from 0.3 mm to 0.5 mm. When the width of the top surface311 of the first resin body 310 is less than 0.3 mm, adhesion betweenthe lead frame 200 and the first resin body 310 is not sufficient. Whenthe width of the top surface 311 of the first resin body 310 is largerthan 0.5 mm, the top surface of the lead frame, from which the lightemitted from the light emitting device 100 is reflected, becomesnarrower, so that the reflection efficiency may be degraded.

Also, as shown in FIGS. 2 to 6, in the light emitting device package 1,the shape of a bottom surface 312 of the first resin body 310 may bedifferent from that of the top surface of the first resin body 310. Thebottom surface 312 of the first resin body 310 may be formed to increasethe contact area between the first resin body 310 and the lead frame200. Therefore, the width of the bottom surface 312 of the first resinbody 310 may be larger than that of the top surface of the first resinbody 310 and may, as shown in FIG. 6, have a plurality of unevenstructures. Specifically, the bottom surface 312 of the first resin body310 may have a straight portion and a curved portion. The width “W2” ofthe straight portion may be 0.1 mm larger than the width “W1” of the topsurface 311. The width “W3” of the curved portion may be 0.1 mm largerthan the width “W2” of the straight portion.

FIGS. 7a to 7c are perspective views showing that the light emittingdevice package according to the embodiment has been coupled to anexternal substrate.

As shown in FIGS. 6 to 7 c, the lead frame 200 of the light emittingdevice package 1 according to the embodiment may include a main terminalformed on the bottom surface of the resin body 300 and an auxiliaryterminal formed on the longitudinal side of the resin body 300.Specifically, the first frame 210 of the lead frame 200 may include afirst main terminal 210 b formed on the bottom surface of the resin body300 and a first auxiliary terminal 210 c formed on the side of the resinbody 300. Also, the second frame 220 of the lead frame 200 may include asecond main terminal 220 b formed on the bottom surface and a secondauxiliary terminal 220 c formed on the side. Therefore, since the lightemitting device package 1 according to the embodiment includes the mainterminals 201 b and 220 b and the auxiliary terminals 210 c and 220 cwhich are for the connection to an external substrate 500, the lightemitting device package 1 may be inspected or repaired by using theauxiliary terminals 210 c and 220 c. Also, the heat generated by thelight emitting device 100 can be radiated by using the first auxiliaryterminal 210 c and the temperature of the light emitting device package1 can be measured by using the first auxiliary terminal 210 c.

FIGS. 7a to 7c show a detailed embodiment using the auxiliary terminals210 c and 220 c of the lead frame 200 of the light emitting devicepackage 1.

As shown in FIGS. 1 to 7 a, the light emitting device package 1according to the embodiment may be mounted on the external substrate500. The light emitting device 100 of the light emitting device package1 may be connected to the second frame 220 by the wire 130, and thesecond main terminal 220 b of the second frame 220 may be connected topower electrodes 510 and 520. Here, when there is a problem in theconnection of the power electrode 510 to any one of the second mainterminals 220 b, the second main terminal 220 b can be connected to anauxiliary power electrode 530 by using the second auxiliary terminal 220c. Therefore, when there is a problem in the electrical connectionbetween the light emitting device package 1 and the external substrate500, the light emitting device package 1 can be inspected or repaired byusing the second auxiliary terminal 220 c without removing the lightemitting device package 1 from the external substrate 500 or withoutadditionally processing the external substrate 500.

Also, as shown in FIGS. 1 to 7 c, the heat generated from the lightemitting device 100 is transferred to the first frame 210, and theauxiliary terminals 210 c and 220 c are formed to be exposed on bothsides of the light emitting device package 1. Therefore, the firstauxiliary terminal 210 c is able to function as a heat sink radiatingthe heat generated from the light emitting device 100. Also, the firstauxiliary terminal 210 c is able to function as a thermal calculator(TC) capable of measuring the temperature of the light emitting device100. Since the light emitting device package 1 according to theembodiment is in direct contact with the light emitting device 100 andthe lead frame 200, the temperature can be accurately measured.

FIG. 8 is a perspective view of the lead frame prototype without thelead frame according to the embodiment.

Referring to FIGS. 5 to 8, the lead frame prototype 400 may include thefirst frame 210, the second frame 220, and the outer frame 410. Anopening may be formed respectively between the first frame 210, thesecond frame 220, and the outer frame 410. A resin may be filled in eachof the openings.

As shown in FIGS. 1 to 8, the concave portion 320 b may be formed on theouter upper portion of the second resin body 320. The lead frameprototype 400 may include a convex portion 410 a formed on the outerframe 410 in response to concave portion 320 b. Therefore, when thelight emitting device package 1 has been coupled to the lead frameprototype 400, the convex portion 410 a is inserted and fixed to theconcave portion 320 b and is caught by a catching protrusion formed onthe upper portion of the concave portion 320 b. Therefore, the downwardmovement of the light emitting device package 1 from the lead frameprototype 400 is limited. The light emitting device package 1 can beseparated only upward from the lead frame prototype 400. Therefore, itis easy to store and transport the light emitting device package 1.

Also, since the lead frame prototype 400 is thick, there occurs a largefriction force between the lead frame prototype 400 and the second outerresin body 320 of the light emitting device package 1. Therefore, thelight emitting device package 1 can be fixed to the lead frame prototype400 without using an adhesive. Since the light emitting device package 1according to the embodiment is fixed to the lead frame prototype 400without using an adhesive, foreign substances are not generated.

FIG. 9 is a perspective view showing that the light emitting devicepackage without the light emitting device mounted thereon is coupled tothe lead frame prototype.

Referring to FIGS. 1 and 9, the light emitting device package 1 isdisposed on the lead frame 200 of the lead frame prototype 400. When theresin body 300 is formed by molding a resin on the lead frame 200, thelight emitting device 100 is mounted on the lead frame 200.

Here, the lead frame prototype 400 may include two lead frames 200 so asto mount two light emitting device packages 1.

FIG. 10 is a perspective view showing a structure of the light emittingdevice package which can be mass-produced.

Referring to FIG. 10, the light emitting device package 1 according tothe embodiment may be mass-produced extending in the form of two rows bya mold. Since the light emitting device package 1 can be mass-producedby the mold, the cost can be reduced.

When the light emitting chip of the light emitting device package 1according to the embodiment is an LED emitting visible light, the lightemitting device package according to the embodiment can be used in alighting device such as a variety of indoor outdoor liquid crystaldisplays, an electric sign, a street lamp, etc. Meanwhile, when thelight emitting chip of the light emitting device package is a DUV LEDemitting deep ultraviolet, the light emitting device package accordingto the embodiment can be used in a humidifier or a water purifier forsterilization or purification.

Hereafter, a process of manufacturing the light emitting device package1 according to the embodiment will be described.

FIGS. 11a to 11f are views for describing a process of manufacturing thelight emitting device package 1 according to the embodiment shown inFIG. 1.

The light emitting device package 1 may be manufactured by a mold. Sincethe light emitting device package I is manufactured upside down, themanufacturing process will be described upside down.

First, as shown in FIG. 11a , the reflector 140 is coupled to a lowermold 610. Then, as shown in FIG. 11b , the lead frame 200 is coupled tothe lower mold 610 to which the reflector 140 has been coupled. Next, asshown in FIG. 11c , an upper mold 620 is coupled on the lead frame 200.Here, a resin injection portion 621 is coupled in response to theopening 230 formed between the first frame 210 and the second frame 220of the lead frame 200. Subsequently, as shown in FIG. 11e , a resin isinjected through the resin injection portion 621. The first resin body310 and the second resin body 320 are formed by the injected resin.Subsequently, as shown in FIG. 11f , the upper mold 620 is removed fromthe lead frame 200. Lastly, the lead frame 200, the reflector 140, thefirst resin body 310 and the second resin body 320 are removed from thelower mold 610, and as a result, the light emitting device package 1 isformed. The thus formed light emitting device package 1 is shown in FIG.8.

Referring to FIGS. 11a to 11c , the reflector 140 is disposed on thelead frame 200 and has a central hollow portion in which the lightemitting device is disposed. The reflector 140 includes a base 141 andan inclined portion 142. The base 141 is formed vertically upward fromthe lead frame 200. The inclined portion 142 has an inclined reflectivesurface and is disposed on the base 141. Here, since the reflector 140is formed by a mold, the reflector 140 may be made of a metallicmaterial, and the base 141 and the inclined portion 142 may beintegrally formed with each other.

In the light emitting device package 1 according to the embodiment,since the reflector 140 is integrally formed by a mold, the reflector140 is wholly uniformly formed, so that the reflection precision isimproved. Also, in the past, a lead has been used for convenience ofmanufacture of the reflector 140. However, the reflector 140 of thelight emitting device package 1 according to the embodiment does notrequire the lead, so that it is possible to prevent foreign substances,etc., from permeating into the light emitting device package 1 from theoutside through the resin body 300. Also, the reflector 140 includes theinclined portion 142 having an inclined reflective surface, in order toreflect the light emitted from the light emitting device. The inclinedportion 142 may be inclined in a direction in a mold process of thelight emitting device package 1. Therefore, since the light emittingdevice package 1 according to the embodiment includes the base 141 whichis formed under and integrally with the inclined portion 142, theinclined portion 142 of the reflector 140 can be prevented from beinginclined. The light emitting device package 1 may be manufactured suchthat the reflector 140 and the lead frame 200 are spaced from each otherby at least 0.1 mm. The insulation layer 323 shown in FIG. 3 may beformed in the space formed between the reflector 140 and the lead frame200.

FIG. 12 is a view showing the final form where the light emitting devicepackage according to the embodiment has been formed on the lead frameprototype.

In the light emitting device package 1 according to the embodiment, aconnection frame 430 shown in FIG. 9 between the lead frame 200 and thelead frame prototype 400 has been removed. Therefore, since the lightemitting device package 1 according to the embodiment is caught by andcoupled to the lead frame prototype 400, the light emitting devicepackage 1 can be easily removed from the lead frame prototype 400.

As such, the reflector 140 of the light emitting device package 1according to the embodiment has a higher accuracy than that of areflector formed by plating or molding a thin metal plate on the leadframe 200. Since the reflector 140 of the light emitting device package1 according to the embodiment is formed by a mold, the reflector 140 maybe made of a metallic material and may be integrally formed withoutbeing cut. Therefore, the inclined surface of the reflector 140 of thelight emitting device package 1 according to the embodiment can beprocessed, so that the reflectance can be more improved. In the past,the reflector has been formed by plating on a resin layer, etc., or byusing a thin metal plate, and thus, the reflection of light was uneven.However, in the light emitting device package 1 according to theembodiment, the reflector 140 is integrally formed by a mold and is madeof a metallic material, so that the light emitting device package 1 hashigh reflection precision. Also, since the reflector 140 of the lightemitting device package 1 according to the embodiment is formed by amold, the reflector 140 can be manufactured without using the lead.Accordingly, since the reflector 140 is completely surrounded by thesecond resin body 320, foreign substances, etc., do not permeate intothe light emitting device package 1.

FIGS. 13a and 13b are views for describing that a release pin is removedfrom the light emitting device package according to the embodiment.

As shown in FIGS. 13a and 13b , in the light emitting device package 1according to the embodiment, a release pin 600 for removing thereflector 140 from the lower mold 610 may be formed at the outside ofthe light emitting device package 1 instead of at the inside “A” of thelight emitting device package 1. When the release pin 600 is located onthe molded body, that is, at the outside of the light emitting devicepackage 1, the lead frame 200 is curved and transformed. For thisreason, it is common that the release pin 600 is located at the inside“A” of the molded body. A removal mark remains in the separation of therelease pin 600 from the body. However, in the light emitting devicepackage 1 according to the embodiment, the lead frame 200 issufficiently thick. Accordingly, even when the release pin 600 is formedat the outside of the light emitting device package 1, the lead frame200 can withstand a stress caused by the separation of the release pin600. Therefore, since the release pin 600 is formed at the outside ofthe light emitting device package 1, the removal mark of the release pin600 does not remain at the inside “A” in which the light emitting deviceis mounted or which is connected through the wire.

FIGS. 14a and 14b are views for describing how to couple a reflector andthe lead frame in accordance with the embodiment.

As shown in FIGS. 11a to 11f and FIGS. 14a and 14b , in theaforementioned method for manufacturing the light emitting devicepackage 1, an adhesive sheet 700 may be disposed on the reflector 140.The adhesive sheet 700 can adhere the reflector 140 to the second frame220 of the lead frame 200. By using the adhesive sheet 700, a spacebetween the lead frame 200 and the reflector 140 in which the insulationlayer 323 is disposed can become smaller.

Although the embodiments of the present invention were described above,these are just examples and do not limit the present invention. Further,the present invention may be changed and modified in various ways,without departing from the essential features of the present invention,by those skilled in the art. That is, the components described in detailin the embodiments of the present invention may be modified. Further,differences due to the modification and application should be construedas being included in the scope and spirit of the present invention,which is described in the accompanying claims.

What is claimed is:
 1. A light emitting device package comprising: alead frame which comprises a first frame element and a second frameelement disposed on both sides of the first frame element respectively;a light emitting device which is disposed on the first frame element andis electrically connected to the second frame; frame element; and aresin body which comprises a first resin body which is disposed betweenthe first frame element, and the second frame, frame element, and asecond resin body which covers an outer surface of the lead frame,wherein an end of the first frame element and an end of the second frameelement are disposed on an outer surface of the second resin body-body,wherein the first resin body comprises a top surface and a bottomsurface, wherein the top and bottom surfaces of the first resin bodycomprise a plurality of straight portions and curved portions, whereinthe width of the straight portion at the bottom surface is larger thanthe width of the straight portion at the top surface, and wherein thewidth of the curved portion is larger than that of the straight portionat the bottom surface.
 2. The light emitting device package of claim 1,wherein the end of the first frame element and the end of the secondframe element protrude more than the outer surface of the second resinbody.
 3. The light emitting device package of claim 1, wherein the endof the first frame element is a thermal calculator (TC) terminal whichmeasures a temperature of the light emitting device.
 4. The lightemitting device package of claim 1, wherein the end of the first frameelement radiates heat generated from the light emitting device.
 5. Thelight emitting device package of claim 1, wherein the width of the topsurface is less than that of the bottom surface.
 6. The light emittingdevice package of claim 1, wherein the width of the top surface of thefirst resin body is from 0.3 mm to 0.5 mm.
 7. The light emitting devicepackage of claim 1, wherein the second resin body comprises a concaveportion which is disposed on an outer surface of the second resin bodyand is coupled to a lead frame prototype, and wherein a catchingprotrusion is disposed on an upper portion of the concave portion. 8.The light emitting device package of claim 1, further comprising areflector which is disposed on the lead frame and has a hollow portionin which the light emitting device is disposed, wherein the second resinbody further comprises a wall which covers an outer surface of thereflector.
 9. The light emitting device package of claim 8, wherein thewall has a recess into which a portion of the reflector is inserted. 10.The light emitting device package of claim 8, wherein the wall comprisesan insulation layer disposed between the bottom surface of the reflectorand the top surface of the second frame element, and a protrusiondisposed on the top surface of the reflector.
 11. The light emittingdevice package of claim 10, wherein a thickness of the insulation layeris from 0.1 mm to 0.15 mm.
 12. The light emitting device package ofclaim 8, wherein the wall comprises a guide protrusion which protrudesupward from the top surface of the wall.
 13. The light emitting devicepackage of claim 1, wherein a black resin is used as the resin body. 14.A light emitting apparatus comprising a substrate and a light emittingdevice package disposed on the substrate, wherein the substratecomprises a first terminal and a second terminal disposed on both sidesof the first terminal respectively, wherein the light emitting devicepackage comprises: a first frame which is electrically connected to thefirst terminal, and a second frame which is disposed on both sides ofthe first frame element respectively and is electrically connected tothe second terminal; a light emitting device which is disposed on thefirst frame element and is electrically connected to the second frameelement; and frame; and a resin body which comprises a first resin bodywhich is disposed between the first frame element and the secondframe-frame element, and a second resin body which covers the leadframe, and wherein an end of the first frame element and an end of thesecond frame element are disposed on an outer surface of the secondresin body, wherein the first resin body comprises a top surface and abottom surface, wherein the top and bottom surfaces of the first resinbody comprise a plurality of straight portions and curved portions,wherein the width of the straight portion at the bottom surface islarger than the width of the straight portion at the top surface, andwherein the width of the curved portion is larger than that of thestraight portion at the bottom surface.
 15. The light emitting apparatusof claim 14, wherein the end of the first frame element and the end ofthe second frame element protrude more than the outer surface of thesecond resin body.
 16. The light emitting apparatus of claim 14, whereinthe end of the first frame element is a thermal calculator (TC) terminalwhich measures a temperature of the light emitting device.
 17. The lightemitting apparatus of claim 14, wherein the end of the first frameelement radiates heat generated from the light emitting device.
 18. Thelight emitting apparatus of claim 14, wherein the second resin bodycomprises a concave portion which is disposed on an outer surface of thesecond resin body and is coupled to a lead frame prototype, and whereina catching protrusion is disposed on an upper portion of the concaveportion.